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Reading: Teledyne FLIR OEM Launches Boson+ IQ Thermal Imaging Development Kit at DSEI UK 2025
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Home » Teledyne FLIR OEM Launches Boson+ IQ Thermal Imaging Development Kit at DSEI UK 2025

World Defence News

Teledyne FLIR OEM Launches Boson+ IQ Thermal Imaging Development Kit at DSEI UK 2025

New Hardware and Software Development Kit Accelerates Thermal Imaging and AI Integration at the Edge.

By SSBCrack
Last updated: September 10, 2025
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Goleta, California. – Teledyne FLIR OEM, part of Teledyne Technologies Incorporated (NYSE: TDY) and the global leader in thermal imaging innovation, today announced the launch of the Boson®+ IQ Development Kit. The comprehensive solution combines reference hardware with Prism™ software, empowering integrators to rapidly develop edge AI capabilities using advanced thermal sensing across defense, security, and industrial platforms.

At the heart of the kit is the Teledyne FLIR OEM AVP, powered by the Qualcomm® Dragonwing™ QCS8550 system-on-chip (SoC), which delivers an industry-leading 50 trillion operations per second (TOPS) with a typical power draw of just 2.5 watts. Its multicore architecture supports Prism AI object detection models and Prism ISP features, including denoising and super resolution to provide exceptional image clarity in challenging environments. 

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“The Boson+ IQ Dev Kit represents a major leap forward for integrators building smarter, more efficient thermal systems at the edge with AI particularly for autonomy applications such as aerial drones, loitering munitions, and ground-based robotics,” said Jared Faraudo, vice president of product management and programs, Teledyne FLIR OEM. “By combining our high-performance Boson+ thermal camera with Prism AI and ISP software on a cutting-edge Qualcomm compute platform, we’re enabling faster development cycles, industry-best image quality, and longer mission endurance with minimal power consumption.”

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Designed for flexibility and scalability, the kit includes interface and carrier boards with three MIPI interfaces, allowing developers to integrate visible or other sensor types into their systems. It also comes with the Boson+ and Prism SDKs, hardware interface control documentation (ICD), and expert engineering support, providing a seamless development experience from prototype to deployment.

The Boson+ IQ Development Kit is future-ready, with compatibility for upcoming additions, including Prism SKR and Prism Supervisor. Prism SKR facilitates autonomous target detection and terminal guidance, while Prism Supervisor offers autonomous operation to designated way points via GPS or visual-based navigation (VBN) location technology. These software-enabled features can add powerful capabilities to mission-critical applications in defense, security, and industrial automation.

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Experience the Boson+ IQ Development Kit in action at the Teledyne FLIR stand (#S3-110) during DSEI UK at ExCeL London, Sept. 9–12, one of the world’s premier defense and security exhibitions. For more information, visit https://oem.flir.com/products/boson-plus-iq-development-kit/.

About Teledyne FLIR
Teledyne FLIR, a Teledyne Technologies company, is a world leader in intelligent sensing solutions for defense and industrial applications with approximately 4,000 employees worldwide. Founded in 1978, the company creates advanced technologies to help professionals make better, faster decisions that save lives and livelihoods. For more information, please visit www.teledyneflir.com or follow @flir.

About Teledyne Technologies
Teledyne Technologies is a leading provider of sophisticated digital imaging products and software, instrumentation, aerospace and defense electronics, and engineered systems. Teledyne’s operations are primarily located in the United States, the United Kingdom, Canada, and Western and Northern Europe. For more information, visit Teledyne’s website at www.teledyne.com.

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